SEC. 1193. CERTAIN EPOXY MOLDING COMPOUNDS. Subchapter II of chapter 99 is amended by inserting in numerical sequence the following new heading: “9902.01.85Epoxy molding compounds, of a kind used for encapsulating integrated circuits (provided for in subheading 3907.30.00)FreeNo changeNo changeOn or before 12/31/2006 ”.
Pub. L. 108-429, tit. I, subtit. A, sec. 1193: CERTAIN EPOXY MOLDING COMPOUNDS. | Justis AI