Default Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for MEMS Manufacturing

Process type factors Process gas i CF 4 C 2 F 6 CHF 3 CH 2 F 2 C 3 F 8 c− C 4 F 8 NF 3 Remote NF 3 SF 6 C 4 F 6a C 5 F 8a C 4 F 8 O a Etch 1-U i 0.7 1 0.4 1 0.4 1 0.06 NA 1 0.2 NA 0.2 0.2 0.1 0.2 NA Etch BCF 4 NA 1 0.4 1 0.07 1 0.08 NA 0.2 NA NA NA 1 0.3 0.2 NA Etch BC 2 F 6 NA NA NA NA NA 0.2 NA NA NA 1 0.2 0.2 NA CVD Chamber Cleaning 1-U i 0.9 0.6 NA NA 0.4 0.1 0.02 0.2 NA NA 0.1 0.1 CVD Chamber Cleaning BCF 4 NA 0.1 NA NA 0.1 0.1 2 0.02 2 0.1 NA NA 0.1 0.1 CVD Chamber Cleaning BC 3 F 8 NA NA NA NA NA NA NA NA NA NA NA 0.4 Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type. 1 Estimate includes multi-gas etch processes. 2 Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive. [75 FR 74818, Dec. 1, 2010, as amended at 78 FR 68225, Nov. 13, 2013]