Federal (United States) · Regulations
Subpart I — Electronics Manufacturing
31 sections
31 sections
- 40 C.F.R. § 98.90Definition of the source category.
- 40 C.F.R. § 98.91Reporting threshold.
- 40 C.F.R. § 98.92GHGs to report.
- 40 C.F.R. § 98.93Calculating GHG emissions.
- 40 C.F.R. § 98.94Monitoring and QA/QC requirements.
- 40 C.F.R. § 98.95Procedures for estimating missing data.
- 40 C.F.R. § 98.96Data reporting requirements.
- 40 C.F.R. § 98.97Records that must be retained.
- 40 C.F.R. § 98.98Definitions.
- 40 C.F.R. Appendix A to Subpart I of Part 98Alternative Procedures for Measuring Point-of-Use Abatement Device Destruction or Removal Efficiency
- 40 C.F.R. Table I-1 to Subpart I of Part 98Default Emission Factors for Manufacturing Capacity-Based Threshold Applicability Determination
- 40 C.F.R. Table I-2 to Subpart I of Part 98Default Emission Factors for Gas Consumption-Based Threshold Applicability Determination
- 40 C.F.R. Table I-3 to Subpart I of Part 98Default Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes
- 40 C.F.R. Table I-4 to Subpart I of Part 98Default Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size
- 40 C.F.R. Table I-5 to Subpart I of Part 98Default Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for MEMS Manufacturing
- 40 C.F.R. Table I-6 to Subpart I of Part 98Default Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for LCD Manufacturing
- 40 C.F.R. Table I-7 to Subpart I of Part 98Table I-7 To Subpart I of Part 98—Default Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for PV Manufacturing
- 40 C.F.R. Table I-8 to Subpart I of Part 98Default Emission Factors (1-UN 2 O ,j ) for N 2 O Utilization (UN 2 O ,j )
- 40 C.F.R. Table I-9 to Subpart I of Part 98Methods and Procedures for Conducting Emissions Test for Stack Systems
- 40 C.F.R. Table I-10 to Subpart I of Part 98Maximum Field Detection Limits Applicable to Fluorinated GHG Concentration Measurements for Stack Systems
- 40 C.F.R. Table I-11 to Subpart I of Part 98Default Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for Semiconductor Manufacturing for Use With the Stack Test Method
- 40 C.F.R. Table I-12 to Subpart I of Part 98Default Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for Semiconductor Manufacturing for Use With the Stack Test Method
- 40 C.F.R. Table I-13 to Subpart I of Part 98Default Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for LCD Manufacturing for Use With the Stack Test Method
- 40 C.F.R. Table I-14 to Subpart I of Part 98Default Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for PV Manufacturing for Use With the Stack Test Method
- 40 C.F.R. Table I-15 to Subpart I of Part 98Default Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for MEMS Manufacturing for Use With the Stack Test Method
- 40 C.F.R. Table I-16 to Subpart I of Part 98Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing
- 40 C.F.R. Table I-17 to Subpart I of Part 98Expected and Possible By-Products for Electronics Manufacturing
- 40 C.F.R. Table I-18 to Subpart I of Part 98Default Factors for Gamma ( g i,p and g k,i,p ) for Semiconductor Manufacturing and for MEMS and PV Manufacturing Under Certain Conditions * for Use With the Stack Testing Method
- 40 C.F.R. Table I-19 to Subpart I of Part 98Reference Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes
- 40 C.F.R. Table I-20 to Subpart I of Part 98Reference Emission Factors (1-U ij ) for Gas Utilization Rates (U ij ) and By-Product Formation Rates (B ijk ) for Semiconductor Manufacturing for 300 mm Wafer Sizes
- 40 C.F.R. Table I-21 to Subpart I of Part 98Examples of Fluorinated GHGs Used by the Electronics Industry